IPS Solder Spheres portfolio
Product offering
Solder Spheres portfolio
The IPS Solder Spheres portfolio covers all applications, from Plastic BGA (PBGA) to Fine pitch BGA (FBGA), Ceramic BGA (CBGA) and Chip Scale Packages (CSP) down to wafer bumping applications. Typical alloys are lead-free composition including the use of Ag, Cu, Sb… All alloy compositions comply with J-STD-006 standard.
| Alloy Examples |
Product specification |
MSDS | |
| Leaded alloys | |||
| High lead alloys | Sn10Pb90 | SBPS1 | SBMSDS1 |
| Standard lead alloys | Sn63Pb37 | SBPS2 | SBMSDS2 |
| Sn62Pb36Ag2 | SBPS3 | SBMSDS2 | |
| Lead free alloys | |||
| SAC (SnAgCu) | Sn95,5Ag4Cu0,5* | SBPS4 | SBMSDS3 |
| Sn96,5Ag3Cu0,5* | SBPS5 | SBMSDS3 | |
| Sn98,5Ag1Cu0,5 | SBPS6 | SBMSDS3 | |
| SAC (+ Ni) | Sn98,5Ag1Cu0,5ND | SBPS7 | SBMSDS4 |
| Size in mil | Size in metric | Tolerances | Jar content | |
| 10 mil | 250µm | +/- 8 µm | 2kk | Samples available |
| 12 mil | 300µm | +/- 10 µm | 1kk | FULL PRODUCTION |
| 14 mil | 350µm | +/- 10 µm | 1kk | |
| 16 mil | 400µm | +/- 10 µm | 1,5kk | |
| 18 mil | 450µm | +/- 10 µm | 1,5kk | |
| 20 mil | 500µm | +/- 20 µm | 1kk | |
| 25mil and above | 635µm and above | +/- 25 µm | 500kk | under request |
Click on the link to download the PDF files 
*IPS is licensee of patent JP#3027441.
Certain alloys may require prior approval from the patent owner.