Solder Powder and Solder Spheres Industries

Led by innovation for the electronic assembly and semiconductor packaging industries.

Solder Powder

Mixed with specific fluxes, Solder Powder is the main element of Solder Pastes used for component assembly on PCB (Printed Circuit Board). IPS Solder Powders are manufactured through a severe Quality Management System that allows the company to serve the market with irreproachable products.

TYPE 3

25-45μm

TYPE 4

20-38μm

TYPE 5

15-25μm

TYPE 6

5-15μm

TYPE 7

2-11μm

TYPE 8

2-8μm

TYPE 9

1-5μm

Solder Spheres

IPS produces solder spheres also called solder balls for BGA , CSP and wafer bumping applications. The technology used to produce soldering spheres ensures quality and performance that are particularly well suited to the most stringent component assembly processes and constraints.

Engineering teams dedicated to Solder Spheres provide particularly well adapted technical expertise and customer support

R&D And Innovation

Thanks to its research and development department, IPS develops its own machines and production processes from scratch. As a result, IPS is able to fine-tune its machines to obtain the final product desired by the customer.
IPS has constantly improved its technology to anticipate market trends. It has mastered the atomization of ultra-fine powders, the manufacture of specific alloys and sorting techniques.

Application

Conventional
solder powders

Ultrafine
solder powders

Surface mount devices on PCB

Fine pitch solder bump and
fine stencil opening

Semiconductor packaging

Mini and Micro LED

Power electronics assembly
Battery assembly