IPS produces solder sphere also called solder balls for BGA , CSP and wafer bumping applications. The technology used to produce soldering spheres ensures quality and performance that are particularly well suited to the most stringent component assembly processes and constraints. Engineering teams dedicated to Solder Spheres provide particularly well adapted technical expertise and customer support
IPS offers sizes ranging from 600µm to 100µm, depending on the alloy.
Please contact IPS sales department for more information.
|SAC (+ Ni)
|High lead alloys
|Standard lead alloys
|Lead free alloys